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Home CAPABILITYManufacturing Capabilities

MANUFACTURING CAPABILITIES SUMMARY

  • Item

    Capability

  • Material

    CEM-3，FR-4(Normal to High Tg)，High CTI FR-4，Polyimide(PI) ，Aluminum Base，Rogers

  • Surface finish

    HAL, HASL Leadfree, ENIG, Chem Tin, OSP, Gold Finger, Immersion Silver, ENEPIG

  • Min. Core thickness

    4mil/0.1mm

  • Prepreg type

    1080, 2116, 7628, 106, 3313, 2165, 1500.

  • Max board size

    24.41X47.24inch/620X1200mm

  • Copper thickness

    Min. base copper 1/3Oz

    Max. base copper 10Oz

  • Min. board thickness

    2- Layer 0.2mm/8mil

    4-Layer 0.35mm/14mil

    6-layer 0.65mm/26mil

    8-Layer 1.0mm/40mil

    10-Layer 1.3mm/51mil

    12-Layer 1.6mm/63mil

    14-Layer 1.8mm/71mil

    16-Layer 2.0mm/79mil

  • AOI (Automatic Optical Inspection)

    Max.table size: 685X685mm

    Max.inspect size: 620X620mm

    Max. thickness: 3.20mm(126mil)

    Min. thickness: 0.10mm(4mil)-core

    Min. width/gap: 3mil/3mil

  • Design & Test

    3mil track width, 3mil tracks width/gap, IPC class 2/IPC class 3,Flying probe/tooling test, Differential impedance, TDR testing, Automatic optical inspection

  • Board thickness Tolerance

    ±0.10mm(4/6layers)

    ±0.13mm(8/10layers)

    ±0.15mm(12/14/16layers)

  • Max.board thickness

    6.0mm/236mil

  • Min.line width/space

    3/3mil

  • Min hole size

    4mil/0.1mm

  • PTH wall thickness

    ≧25µm

  • Max. aspect ratio

    12:01

  • PTH dia. Tolerance

    ±0.075mm/3mil(Standard), ±0.05mm/2mil(Advanced)

  • NPTH dia. Tolerance

    ±0.05mm/2mil (On laminate area)

    ±0.03mm (On ground area)

  • Hole location Tolerance

    ±0.075 (Standard) ±0.05mm (Advanced)

    ±0.13 (2nd drilled hole to 1st drilled hole location (mm)

  • Slot size tolerance

    ±0.075mm (board thickness≤1.0mm)

    ±0.10mm (board thickness>1.00mm)

  • V-CUT Remain thickness tolerance

    ±0.10mm (Standard), ±0.076mm (Advanced)

  • Peelable mask Thickness

    ≥8mil (0.2mm)

  • Insulation Resistance

    >1012Ω

  • Through hole Resistance

    <300Ω

  • Current breakdown

    10A

  • Peel Strength

    1.4N/mm

  • S/M Abrasion

    >6H

  • Thermal stress

    288℃ 20Sec

  • Test Voltage

    >20-300V

  • Min.blind/burried via

    >4mil/0.1mm

  • Impedance control

    >(50Ω-100Ω) ± 10% (Standard)、(50Ω-100Ω) ± 7% (Advanced)

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MANUFACTURING EQUIPMENTS AT KESHIJIA

For more than 14 years, we have been produced printed circuit boards for over 2500 companies throughout Europe, North America and Asia, including factories and distributors.Our manufacturing facilities dose inspect the whole materials and manage the whole production process carefully to ensure quality control.

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